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ARM946E-S

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Embedded Core with Flexible Cached Memory System & DSP Instruction Set Extensions

The ARM946E-S™ processor is a synthesizable macrocell well suited to a wide range of embedded applications. It combines an ARM9E-S™ CPU with flexible instruction and data caches, instruction and data tightly coupled memory (TCM) interfaces, a protection unit, and an AMBA AHB interface. The size of the instruction and data cache, and instruction and data TCM memories are configurable to allow tailoring of the hardware to the embedded application. The ARM946E-S processor supports ARM's real-time trace technology with the addition of the optional ETM9 macrocell. The core implements the ARMv5TE instruction set and features an enhanced 16 x 32-bit multiplier capable of single cycle MAC operations, and 16-bit fixed point DSP instructions to accelerate signal processing algorithms and applications. The ARM946E-S provides a complete high-performance processor solution, reducing system complexity, die size, power consumption and time-to-market.ARM946E-S pic 
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ARM Foundry Program
A hardened implementation of the ARM946E macrocell is available via the ARM Foundry Program

Applications

  • Embedded applications running an RTOS
  • 2.5G and 3G baseband processor
  • Speech codecs
  • Imaging products
    –Printers, digital cameras
  • Networking systems
  • Automotive control
    –Powertrain with optional VFP9-S floating point coprocessor

Features:

  • 32/16-bit RISC architecture (ARMv5TE)
  • 32-bit ARM instruction set for maximum performance and flexibility
  • 16-bit Thumb instruction set for increased code density
  • Memory Protection Unit (MPU) supporting all major RTOS: Vxworks, pSOS
  • Flexible instruction and data cache sizes
  • Instruction and data TCM interfaces
  • Industry standard AMBA AHB interface
  • Floating point support with the optional VFP9-S coprocessor
  • EmbeddedICE-RT logic for real-time debug
  • ETM interface for Real-time trace capability with ETM9
  • ARM-Synopsys Reference Methodology compliant deliverables
  • Optional MOVE Coprocessor delivers video encoding performance

Benefits:

  • Single chip MCU & DSP capable core
  • No duplication of on-chip memory, bussing, debug or trace resources
  • Process portable synthesizable design
  • Single unified software development and debug environment:
  • Multiple sourcing from industry-leading silicon vendors
  • Code-compatible upward migration path to the ARM10E family
  • Excellent debug support for SoC designers
  • Fast interrupt response and context switch.
  • Performance split between DSP and controller code can vary dynamically, as system requirements change.
  • Instruction set can be extended by the use of coprocessors
  • ARM-EDA Reference Methodology deliverables significantly reduce the time to generate a specific technology implementation of the core and to generate industry standard views and models.
 

 

 

Performance Characteristics  Top Right Corner
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*0.180.1390 nm
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*  Speed
Opt
Speed
Opt
Area
Opt
Speed
Opt
Area
Opt
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*Standard Cells SAGE-XSAGE-HSSAGE-XAdvantage-HSMetro
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*Memories HSHDHSHDHSHDAdvantageMetro
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*       
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*Frequency* (MHz) 166230200440230
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*Area with cache (mm²) 5.322.191.861.010.65
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*Area without cache (mm²) 2.001.070.970.610.30
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*Cache Size 8K/8K8K/8K8K/8K8K/8K8K/8K
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*Power with cache (mW/MHz) 1.300.490.460.170.11
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*Power w/o cache (mW/MHz) 0.860.370.310.140.08
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Core area, frequency range and power consumption are dependent on process, libraries and optimizations. The numbers quoted above are illustrative of synthesized cores using general purpose TSMC process technologies and ARM Artisan standard cell libraries and RAMs.

The speed optimized implementations refer to the library choices and synthesis flow decisions and tradeoffs made in order to achieve the target frequency performance. The area optimized implementations refer to the library choices and synthesis flow decisions and tradeoffs made in order to achieve a target area density.

The cache sizes are specified as InstructionCache/DataCache. The area w/o cache numbers quoted exclude RAM area, but include all logic including memory management, cache control and debug. The area with cache numbers quoted includes the core, the specified instruction and data caches and all necessary RAMs.

* Worst case conditions –   0.18µm process - 1.62V, 125C, slow silicon ;  0.13µm process - 1.08V, 125C, slow silicon ;  90nm process - 0.9V, 125C, slow silicon
† Typical case conditions– 0.18µm process–1.8V, 25C, typical silicon ;  0.13µm process - 1.2V, 25C, typical silicon ; 90nm process - 1V, 25C, typical silicon

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