ARM7TDMI

• Personal audio (MP3, WMA, AAC players)
• Entry level wireless handset
• Pager
• Ink-jet/bubble-jet printer
• Digital still camera

Features:

• 32/16-bit RISC architecture (ARM v4T)
• 32-bit ARM instruction set for maximum performance and flexibility
• 16-bit Thumb instruction set for increased code density
• Unified bus interface, 32-bit data bus carries both instructions and data
• Three-stage pipeline
• 32-bit ALU
• Very small die size and low power consumption

• Coprocessor interface
• Extensive debug facilities:
  –EmbeddedICE-RT real-time debug unit
  –JTAG interface unit
  –Interface for direct connection to Embedded Trace Macrocell (ETM)

Benefits:

• Generic layout can be ported to specific process technologies
• Unified memory bus simplifies SoC integration process
• ARM and Thumb instructions sets can be mixed with minimal overhead to support application requirements for speed and code density
• Code written for ARM7TDMI is binary-compatible with other members of the ARM7 Family and forwards compatible with the ARM9 and ARM9E families
• Small die size reduces overall SoC area, cost and power consumption
• Low power consumption enables battery-powered devices
• Instruction set can be extended for specific requirements using coprocessors
• EmbeddedICE-RT and optional ETM units enable extensive, real-time debug facilities

* Worst case conditions –   0.18µm process - 1.62V, 125C, slow silicon ;  0.13µm process - 1.08V, 125C, slow silicon ;  90nm process - 0.9V, 125C, slow silicon
† Typical case conditions– 0.18µm process–1.8V, 25C, typical silicon ;  0.13µm process - 1.2V, 25C, typical silicon ; 90nm process - 1V, 25C, typical silicon