Accelerated AI Performance
Chips optimized for large-model workloads.
Scalable Solutions
From base software to full AI stack.
Global Expansion
Supporting OEMs and Tier 1s worldwide.
Arm Architecture
Black Sesame Technologies’ Al chips leverage the Arm architecture, benefiting from a robust ecosystem of hardware, software, and developer support. Arm CPUs provide the scalability and efficiency needed for both real-time processing and high-performance Al workloads. This foundation enables Black Sesame Technologies to rapidly develop new chip generations that meet the rising computational demands of large-model Al in autonomous driving. As automotive innovation accelerates, and with cycle times shrinking to 1-1.5 years, the Arm ecosystem helps reduce R&D cost and time. With Arm, Black Sesame Technologies reduces development time and ensures compatibility across a wide range of automotive platforms.
Black Sesame Huashan Series AI Chips
The Huashan series from Black Sesame Technologies helps OEMs and Tier1s deliver Al-defined use cases for drivers. As a high-performance chip platform designed for next-generation AI models, it supports both perception and decision-making tasks across L2-L5 driving automation. Beyond hardware, Black Sesame Technologies provides full-stack solutions, including self-developed IP cores, algorithms and support software, that allow OEMs and Tier1s to accelerate deployment. With continuous innovation, the Huashan Series bridges the gap between chip design and end-to-end Al system integration, setting a new benchmark for intelligent vehicle platforms.