Common Platform Technology Forum 2013


Santa Clara Convention Center


Santa Clara, CA


05 February 2013



Advanced Physical IP Leadership

Join us at the Common Platform Technology Forum and learn more about how ARM is collaborating with GLOBALFOUNDRIES, IBM and Samsung to deliver a proven path to silicon on leading Common Platform process technologies including 90nm, 65nm, 45nm, 32nm, 28nm, 20nm and 14nm FINFET. Advanced manufacturing technology is essential to meet the requirements of the mobile and server computing markets. In collaboration with GLOBALFOUNDRIES, IBM and Samsung, ARM is delivering a full design platform of integrated process, processor and physical IP to lower the risk and reduce engineering costs associated with advanced node design.

The Common Platform Technology Forum will focus on access to industry-ready technology, proven design solutions and advanced technologies for high-growth markets such as mobile and low power. Technical details of the innovative HKMG process technology for low-power applications will be revealed, along with technology advancements in SoC enablement solutions, materials science, process technology and manufacturing.

Santa Clara Convention Center

The Santa Clara Convention Center is a complete meeting venue in the heart of Silicon Valley, CA, just south of San Francisco off Interstate I-101 at Great America Parkway.

Live Event + Online Event

The 2013 forum offers the industry a live event as well as an online event for those not able to attend in person. Visit commonplatform.com for more details and to register. Industry Keynote – Simon Segars, Executive Vice President and General Manager, Processor and Physical IP Divisions

Exhibit Hours: 11:30 am – 6:00 pm

See demos for the following products, ready for leading-edge process technology: 32nm / 28nm optimized physical IP for GLOBALFOUNDRIES, IBM and Samsung technology and find out how our collaboration with the Common Platform™ (IBM, Samsung and GLOBALFOUNDRIES) and leading EDA partners accelerates your path to silicon on leading-edge system-on-chip advanced node design.

For additional information on Common Platform Technology Forum, please visit the event page.


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