The partnership will deliver reference designs and physical design knowledge to integrate ARM Cortex® processors, ARM CoreLink™ system IP, and ARM Artisan® physical IP along with RF/analog/mixed-signal IP and embedded flash in the Virtuoso®-VDI Mixed-Signal Open Access integrated flow for the new TSMC process technology offerings of 55ULP, 40ULP and 28ULP.
"TSMC's new ULP technology platform is an important development in addressing the IoT's low-power requirements," stated Nimish Modi, senior vice president of Marketing and Business Development at Cadence. "Cadence's low-power expertise and leadership in mixed-signal design and verification form the most complete solution for implementing IoT applications. These flows, optimized for ARM's Cortex-M processors including the new Cortex-M7, will enable designers to develop and deliver new and creative IoT applications that take maximum advantage of ULP technologies."
"The reduction in leakage of TSMC's new ULP technology platform combined with the proven power-efficiency of Cortex-M processors will enable a vast range of devices to operate in ultra energy-constrained environments," said Richard York, vice president of embedded segment marketing, ARM. "Our collaboration with Cadence enables designers to continue developing the most innovative IoT devices in the market."
This new collaboration builds on existing multi-year programs to optimize performance, power and area (PPA) via Cadence's digital, mixed-signal and verification flows and complementary IP alongside ARM Cortex-A processors and ARM POP™ IP targeting TSMC 40nm, 28nm, and 16nm FinFET process technologies. Similarly, the companies have been optimizing the solution based around the Cortex-M processors in mixed-signal SoCs targeting TSMC 65/55nm and larger geometry nodes. The joint Cortex-M7 Reference Methodology for TSMC 40LP is the latest example of this collaboration.
For more information on ARM and Cadence collaboration activities attend ARM TechCon 2014, October 1-3 at the Santa Clara Convention Center. Papers will be presented in the technical tracks as well as demonstrations at their respective booths in the exhibit.
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