Login

TTPCOM and ARM Collaborate On The World’s First Complete IP Platform For Multimode, 3G Baseband Designs

31 January 2005

Strategic collaboration will accelerate access to 3G market for semiconductor vendors and create a standard for 3G baseband chipset designs

CAMBRIDGE, UK – Jan, 31, 2005 – TTP Communications plc.[LSE: TTC] and ARM [(LSE:ARM); (Nasdaq:ARMHY)], today announced a strategic collaboration to design and develop the next generation of 3G Intellectual Property (IP) platforms, incorporating ARM® processors and TTPCom Cellular Baseband Engine (CBEmacro) technology. The new platforms will significantly reduce engineering effort and time-to-market for semiconductor vendors developing 3G system-on-chip (SoC) solutions. TTPCom will distribute the combination of an ARM technology-based subsystem and TTPCom’s multimode 3G baseband to semiconductor manufacturers to enable them to get their products to market quickly, with lower cost and risk. ARM will be responsible for licensing the processor core to its silicon partners whilst TTPCom will license the CBEmacro technology.

The first of these platforms will be the CBEmacro 3G, a multimode cellular baseband engine, which provides a complete communications sub-system for GSM, GPRS, EDGE, WCDMA and HSDPA (High Speed Downlink Packet Access). The CBEmacro 3G is delivered pre-verified and warranted, enabling licensees to bring innovative and price competitive products to market more rapidly. The CBEmacro 3G is based on the ™ processor and incorporates AMBA™3 AXI methodology, PrimeCell® peripherals and CoreSight™ debug technology. This delivers significant efficiency and performance advantages whilst also providing a familiar processor architecture for semiconductor vendors and their customers. Licensees of CBEmacro 3G will be able to re-use their existing investment in ARM tools and design flows, and rapidly integrate with their in-house IP to make complete cellular SoC products.

“The winning combination of our 3G technology and ARM leading-edge processors will enable silicon Partners to bring high-performance 3G baseband semiconductor solutions to the mass market,” said Tony Milbourn, MD of TTPCom. “The complexity associated with implementing global cellular wireless standards has now been eased. CBEmacro 3G enables silicon Partners and their OEM/ODM customers to reduce integration costs and bring products to market more quickly. By outsourcing the modem design, our mutual customers will be able to focus on more profitable and sustainable sources of product differentiation. This collaboration will instigate change within our industry.”

“Over the last 10 years, TTPCom has become a leader in wireless technology IP and has established a reputation for innovation,” said Warren East, CEO, ARM, “This collaboration between two of the industry’s leading IP vendors will result in a family of ARM Powered® CBEmacro products that will enable our mutual customers to remain competitive, both now and into the future.”

To find out more, visit TTPCom and ARM at the 3GSM World Congress in Cannes, February 14-17: TTPCom stand #A3, Hall 1; and ARM at stand #K13 in Hall 4.

About TTPCom’s Cellular Baseband Engine Macro (CBEmacro)
CBEmacro is a family of complete and ready for silicon 2G/3G Cellular Baseband Engines, that will get semiconductor vendors to market for a know risk and cost. The underlying technology, CBEcore, is well proven and has appeared in numerous cellular baseband chipsets manufactured by world leading semiconductor vendors since its creation in 1993.

About TTP Communications plc
Based in Cambridge, UK, TTP Communications plc (LSE: TTC) through its subsidiary TTPCom Limited, develops intellectual property used in the design and manufacture of wireless communication terminals.  TTPCom licenses its technology to leading semiconductor and terminal manufacturers worldwide, including Analog Devices, Intel, LG, Renesas, Sharp, Siemens and Toshiba.

TTPCom has established an industry standard with its GPRS platform, offers EDGE, 3G, Wireless LAN and Wireless PAN solutions and, for those manufacturers for whom a fast time to market is critical, TTPCom also offers complete handset and module designs.  Over 30 million devices using TTPCom technology were shipped during 2004.  More information can be found on TTPCom’s website at: http://www.ttpcom.com.

About ARM
ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM’s comprehensive product offering includes 16/32-bit RISC microprocessors, data engines, 3D processors, digital libraries, embedded memories, peripherals, software and development tools, as well as analog functions and high-speed connectivity products. Combined with the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com/

ENDS


ARM, ARM Powered and PrimeCell are registered trademarks of ARM Limited.  ARM1156T2-S, CoreSight and AMBA are trademarks of ARM Limited. All other brands or product names are the property of their respective holders. “ARM”' is used to represent ARM Holdings plc; its operating company ARM Limited; and the regional subsidiaries ARM INC.; ARM KK; ARM Korea Ltd.; ARM Taiwan; ARM France SAS; ARM Consulting (Shanghai) Co. Ltd.; ARM Belgium N.V.; AXYS Design Automation Inc.; AXYS GmbH; ARM Embedded Solutions Pvt. Ltd.; and ARM Physical IP, Inc.

Michelle Spencer
ARM
Tel: +44 (0) 1628 427780
Email: michelle.spencer@arm.com
Peter Davies
TTPCom Limited
Tel: +44 (0) 1763 266266
Email: peter.davies@ttpcom.com