14 October 2008

Adeneo Releases Windows CE 6.0 BSP For ARM9 SoC

Adeneo, a member of the ARM Connected Community, has unveiled the full commercial release of its Windows CE 6.0 BSP (board support package) for an ARM9 SoC (system-on-chip) launched earlier this year by NXP.

The release supports the LPC3250 ARM9 processor-based microcontroller from NXP Semiconductors, which is  targeted at consumer, entertainment, industrial, medical and automotive industries.

The LPC3250 ARM based microcontroller features a 266 MHz ARM926EJTM core, 256 KB SRAM, Vector Floating Point (VFP), 24-bit LCD Controller, 10/100 Ethernet MAC, On-The-Go USB, and a large set of standard peripherals offering embedded designers the ability to reduce on-chip components and maximize power savings without sacrificing performance.

Because of its compliance with Microsoft PQOAL (Production-Quality OEM Adaptation Layer) and PQD (Production Quality Device) specifications, the LPC3250 BSP from Adeneo is the most cost-effective way to develop custom solutions using NXP Chipsets and Windows Embedded CE with the minimal redesign, the company said. Only the portions of the BSPs handling board features need to be reviewed and redesigned and all code linked to the core CPU can be reused without modifications.

“The addition of the WinCE 6.0 BSP to the LPC3250 by Adeneo is a great opportunity for NXP”, said Geoff Lees, vice president, product line microcontrollers, NXP Semiconductors. “With the services offered by Adeneo our customers can develop next generation consumer applications with ease and bring them to market quickly.”

The BSP includes all the drivers for most of the peripherals integrated in LPC3250 chip, including Display, Touchscreen, Audio, Ethernet, USB, Serial, SPI, I2C, SDCard as well as key features of the chip such as advanced power management and Vector Floating Point support. This allows targeting all types of custom solutions, the company said.