ChipletT and ChipsetT - Next Generation Chip Embedding Solutions for ARM Designs by FlipChip International, LLC

Product Description

ChipletT - a fan-out wafer level package (FOWLP)

ChipsetT – a single or multi-die sytem-in-package (SiP)

Ultra-low profile packaging solutions that improve ARM designs, by delivering:
• Low RF Loss
• Full 3-D Package Integration
• Enhanced Thermal Dissipation
• Form Factor Miniaturization
• Improved Package Robustness
• Ability to incorporate SMT Passive devices

ChipletT & ChipsetT solutions leverage flex circuit technology from Fujikura. ChipletT & ChipsetT enable ARM-enriched silicon embedding in Ultra Low Profile Packages!

Low Cost Economy of Scale for cost-competitive ARM packaging:
• > 3500 Module/Panel (typical 4.5x4.5mm)
• Simultaneous Layer Lamination
• Panel size Extendibility to 250 x 350mm & 350 x 500mm

Industry's Lowest Profile Embedded Package for ARM Designs!
• Package Thickness 240μm incorporating -
• Thinned WLP: 85μm thick
• Adhesive film: 25μm thick
• Polyimide film: 25μm or 50μm thick
• Copper foil: 12μm or 18μm thick

(ChipletTTM and ChipsetTTM are trademarked solutions of FlipChip International, LLC, Phoenix, AZ, USA)

ChipletT and ChipsetT - Next Generation Chip Embedding Solutions for ARM Designs!

Market Segment(s)

• Embedded
• Mobile
• Mobile Computing

Companion Processor(s)

• Biometrics
• Communication
• DSP
• Flash
• I/O
• Multimedia

ARM Processor(s)

• ARM7EJ-S
• ARM7TDMI
• ARM7TDMI-S
• ARM720T
• ARM920T
• ARM922T
• ARM926EJ-S
• ARM940T
• ARM946E-S
• ARM966E-S
• ARM968E-S
• VFP9-S
• ARM1020E
• ARM1022E
• ARM1026EJ-S
• VFP10
• ARM1136J-S
• ARM1136JF-S
• ARM1156T2(F)-S
• ARM1176JZ(F)-S
• ARM11 MPCore
• Cortex-A15
• Cortex-A5
• Cortex-A8
• Cortex-A9
• Cortex-M0
• Cortex-M1
• Cortex-M3
• Cortex-M4
• Cortex-R4
• Cortex-R5
• Cortex-R7
• SC000
• SC100
• SC200
• SC300
• ARMv4
• ARMv5
• ARMv6
• ARMv7
• StrongARM
• XScale
• Mali55
• Mali-200+GP2
• Mali-400
• Mali-T604