Package/Board Design and Analysis Services by Bayside Design Inc
SoC Design Services or Consulting
Product Description
Bayside Design Inc (BDI for short) is a leading supplier focused on providing High Speed Design and Verification Services and Solutions. BDI was formed by ex-Velio Communications Inc (product team sold to LSI Logic, Inc and the IO team to RAMBUS), founding engineers with collective working experience of over 150+. We have over 100 leading edge customers comprising of Silicon Vendors, IP providers, Fabless Semiconductor Companies, Fortune 500 companies and many Startup companies. We have executed over 150 projects and all of them have been first pass success and we can provide you with our customer successes and references under NDA. We are utilizing our knowledge and expertise to develop unique IP and products which enables us to provide comprehensive verification services and solutions. We designed IC packages for ARM for verification and testing of core and IO IP. This involved working closely with the IC team as well as board team. The verification process was very detailed and involved both signal and power integrity in a systems environment. We have developed a huge interconnect library call BDILIBTM which is production proven and has hundreds of interconnect structures which are production proven. We have done many package and board (co-design) projects to address customer electrical. timing, cost/layer count requirements in a systems environment. We also have designed many high performance bring-up boards, reference boards as well as load boards. We are familiar with PCIe gen1, 2 and 3; USB 2 &3; SATA 1 & 2; USB 2 & 3; XAUI, Interlaken, XFI, CEI 11, CEI28, DDR2 &3 and many more.
Package/Board Design and Analysis Services
Market Segment(s)
- Embedded
- Enterprise
ARM Processor(s)
- Cortex-A53
- Cortex-A57
- Cortex-A9
- ARMv8
Physical IP
- DDR I/O (DDRI/II)
- General Purpose I/O (Inline / Staggered)
- Specialty I/O (HSTL, SSTL)
- Standard Cell Libraries
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