Cadence Engineering Services by Cadence Design Systems

SoC Design Services or Consulting

Product Description

Cadence Engineering Services
ARM Approved Design Center Program Partner

If your challenge is achieving fast and accurate implementation of a single ASIC design, or the complex task of building multi-million gate system-on-chip designs, Cadence Engineering Services can deliver for you.
Cadence offers its clients access to world-class IC design expertise to help them meet the challenges of SoC integration. We offer tailored solutions to meet your specific needs from the broadest portfolio of services available in the electronics industry:
 Design Services from Architecture to GDSII
 Tailored, Benchmarked Methodologies to Maximise Designer Productivity
 Provision of Hosted Design Systems: Hardware; Software; IT; CAD; & Methodology outsourcing

Specifically, ARM licensees can realise superior silicon in a faster time by benefiting from the extensive experience Cadence has developed since becoming the first ADC partner in 1998 and subsequently delivering over 70 successful ARM design tape-outs.
Only Cadence Engineering Services can provide world-class engineering skills, dedicated professional project management, and the quality and integrity you expect from the world's largest design solution provider.

Highlights
• Experience with designs up to 2GHz, more than 65M gates and IO speeds greater than 12. 8 GHz
• 75+ ARM core-based SoCs to date
• 80+ tape outs in leading foundries during the past 18 months, including traditional ASIC and pure-play foundries such as TSMC
• Over 60 tapeouts completed or in progress at 65nm and below
• First ARM Approved Design Center partner in 1998
• Consistent 1st Silicon Success™
• Range of hard and soft standards based IP modules

Recent Design Projects at 65nm and 40nm
• ARM SoC Integration: Re-programmable Processor Platform
­ ARM11 CPU
­ 5M gates +12Mb Memory
­ 600MHz in 45nm
­ USB, DDR2/3, Ethernet, PCIe
­ Coresight Debug and Emulation
• ARM SoC Integration: Packet Processor
­ Dual ARM11
­ 3M gates +12Mb Memory
­ 500MHz in 65nm
­ USB, DDR2, PCIe
­ Emulation
• Multi-Standard SerDes Core
­ 15 different standards
­ Includes PCS
­ 40nm
• 10G AFE Receiver
­ Quad 11 Bit 800MHz ADCs
­ Dual LC low noise synthesizers
­ 40nm
• SerDes Array
­ 168 8+ GHz SerDes
­ Includes on-chip laser drivers and receivers
­ >1 TBs composite data rate
­ 65nm
• Wireless AFE
­ Dual 6 Bit 2.6 GSs ADCs and DACs
­ 2.6 GHz synthesizer
­ Dual 8 GHz synthesizers
­ Low noise oscillator
­ 65nm
• Package-aware IC and board design
­ Support for concurrent IC/IC-package IRdrop & low power design
­ IC-package-level Signal Integrity, e.g. DDR2/3, GBit-Ethernet, 2.4 GB/s SerDes

For further information on Cadence services and IP modules visit our website http://www.cadence.com/engr_services

Cadence Engineering Services contact information:
USA: 408.943.1234
EMEA: 44.1344.3603

Cadence Engineering Services

Market Segment(s)

• Embedded
• Enterprise
• Home
• Mobile
• Mobile Computing

ARM Processor(s)

• ARM7EJ-S
• ARM7TDMI
• ARM7TDMI-S
• ARM720T
• ARM920T
• ARM922T
• ARM926EJ-S
• ARM940T
• ARM946E-S
• ARM966E-S
• ARM1020E
• ARM1022E
• ARM1026EJ-S
• ARM1136J-S
• ARM1136JF-S
• ARM1156T2(F)-S
• ARM1176JZ(F)-S
• ARM11 MPCore
• Cortex-A53
• Cortex-A57
• Cortex-A8
• Cortex-A9
• Cortex-M0
• Cortex-M1
• Cortex-M3
• Cortex-R4
• ARMv7
• ARMv8
• StrongARM
• Mali55
• Mali-200+GP2
• Mali-400

System IP

• Debug
• Interconnect Fabric
• Level 2 Cache Controller
• Memory Controller

Physical IP

• DDR I/O (DDRI/II)
• General Purpose I/O (Inline / Staggered)
• Register File Memory Compilers
• Specialty I/O (HSTL, SSTL)
• SRAM Memory Compilers
• Standard Cell Libraries

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