WINCE 6.0 R2 BSP OMAP35xx by CeWiDus Technologies Pvt Ltd

Board Support Packages(BSPs)

Product Description

The new OMAP3530 Features include
1) OMAP™ 3 Architecture
2) MPU Subsystem
a) 600-MHz ARM Cortex™-A8 Core
b) NEON™ SIMD Coprocessor
3) High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
a) 430-MHz TMS320C64x+™ DSP Core
b) Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
c) Video Hardware Accelerators
4) 2D/3D Graphics Accelerator (OMAP3530 Device Only)
5) Fully Software-Compatible with C64x and ARM9™
6) Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core

CeWiDus has developed the Windows CE 6.0 R2 BSP on OMAP 3530 and shocased in ET 2008 exhibition at Pacifico Yokohama Japan.

WinCE 6.0 (R2) BSP on ARM side only includes, following:
• Boot loader
• OAL
• Display Driver
• Debug Serial Driver
• Touch Panel Driver
. NAND Image bootup

WINCE 6.0 R2 BSP OMAP35xx

Market Segment(s)

• Embedded

ARM Processor(s)

• Cortex-A53
• Cortex-A57
• Cortex-A8
• ARMv5
• ARMv8

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