WINCE 6.0 R2 BSP TI DM6467 by CeWiDus Technologies Pvt Ltd

Board Support Packages(BSPs)

Product Description

The TI DM6467processor consists of an integrated ARM9 and C64x+ DSP core and a High-Definition Video/Imaging Co-Processor (HD-VICP). CeWiDus has developed Windows CE 6.0 R2 BSP and demonstrated Network Projector demo in ET 2008 exhibition at pacifico yokohama.

WinCE 6.0 (R2) BSP on ARM side only includes, following:
- Boot loader
- OAL (specific to DM6467)
- Video Driver
- Display Driver
- Debug Serial Driver
- Ethernet Controller Driver
- Audio Driver

CeWiDus is the first company to have developed Windows CE 6.0 R2 BSP on TMS320DM6467 TI Davinci

WINCE 6.0 R2 BSP TI DM6467

Market Segment(s)

• Embedded

ARM Processor(s)

• ARM926EJ-S
• Cortex-A53
• Cortex-A57
• ARMv5
• ARMv8

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