SoC Design and Manufacturing Services by Avnet ASIC Israel, LTD.

SoC Design Services or Consulting

Product Description

Avnet ASIC Israel Ltd. - AAI
SoC Design Services and Turn-Key Manufacturing

Complete RTL to GDSII Design Services:
· Gate Library, I/O and memories selection and support
· Power consumption issues, impact on performance, package impact
· IP selection and integration
· Initial Synthesis with Wire Load Models
· Physical Synthesis and Timing Closure after floorplanning
· Test Strategy, insertion and ATPG: SCAN, BIST, JTAG, Iddq, etc.
· Clock Strategy Definition and implementation
· Static Timing Verifications
· Formal verifications
· Power Grid Design
· Floorplanning and Place&Route
· Signal Integrity Effects - IR Drop, Cross talk prevention
· Physical extraction and delivery of back-annotation files

Logic Design Services:
· RTL design of blocks per customer specifications
· Integrating ARM CPU cores and AHB and APB peripherals
· Other IP sub-system design (DSP cores, analog, etc.)
· Top level design: I/O ring, Test Mode block, Clocks, PLL’s

GDSII to Engineering Samples Services:
· Setting up correct Run-Sets for DRC, LVS and Extraction
· Transistor Merge, Transistor Level DRC/LVS
· Chip Finishing (Seal Ring, Tiling, Artifacts, etc.)
· Sign-off and Tape-Out to the Foundry
· Packaging, Testing, debugging and Engineering Samples delivery

Post-Silicon and Mass Production Services:
· Package definition and effect on design (thermal and electrical)
· Bonding (double-bond, power rings, bonding to few packages)
· Test Platform selection, test vector format conversions
· Test Program SOW definition (vectors, parameters, multi-site)
· Test Boards (Load Board, Probe Card) requirements
· Test program debug and optimization
· Wafers manufacturing, Assembly and Test production coordination
· Production logistics: Shipments, Die Banks, Final Stocks
· Production Optimization: Yield analysis and improvement

Turnkey Manufacturing Services:
- Assembly & Test
- Yield & test optimization
- Prototype & mass production
- Material & distribution management

Technologies:
- Philips: 0.18µ, 0.13µ, 90nm
- Tower: 0.18µ, 0.13µ
- TSMC: 0.18µ, 0.13µ
- Mixed signal analog/digital

SoC Design and Manufacturing Services

Market Segment(s)

• Embedded
• Enterprise
• Home
• Mobile

ARM Processor(s)

• ARM7TDMI
• ARM920T
• ARM922T
• ARM926EJ-S
• ARM940T
• ARM946E-S
• Cortex-A53
• Cortex-A57
• ARMv8

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