Common Platform & Joint Development Alliances

IBM, Chartered Semiconductor Manufacturing and Samsung Electronics have forged a unique manufacturing collaboration for several generations of bulk CMOS process technologies spanning 90nm, 65nm, 45nm, and 32/28nm. The Common Platform™ combines the expertise and research resources of all three companies and leverages advances such as high-k metal gate technology, 193nm immersion lithography and ultralow-k dielectric. This technology collaboration accelerates the availability of leading-edge technology to the broader semiconductor community. The Common Platform model provides an open ecosystem supporting comprehensive design-enablement solutions. Thus enabling foundry customers to easily manufacture their chip designs to the three companies' 300-mm foundries with a single GDS-II image, offering unprecedented flexibility and choice. In addition, the Common Platform solution consists of a complete range of design support from leading EDA, library and IP, and design services providers. For more information, please visit www.commonplatform.com

In the latest collaboration, ARM and the Common Platform are working together to enable leading SoC implementations on the Common Platform 32/28nm semiconductor processes based on high-k metal-gate (HKMG) technology. For more information about ARM collaboration with Common Platform. ARM High Performance Physical IP for Common Platform - Logic, Memory, Interface IP available now for download.

In addition to the three Common Platform technology companies, the Joint Development Alliance members (JDA) collaborate to enable the fundamental CMOS development for these process nodes and contribute valuable expertise in key application areas:

• Besides IBM, Chartered and Samsung, additional JDA members at the 32/28nm nodes also include AMD, Freescale, Infineon, NEC, ST Microelectronics and Toshiba
• Teams of engineers work together at IBM's East Fishkill, NY R&D facility to drive the next generation of manufacturing innovation, new techniques, materials and equipment
• Each new process is developed and tested before being deployed around the world to other manufacturing facilities

• ChipEstimate.com
• Forlinx Embedded Technology Co., Ltd.
• Freescale
• GLOBALFOUNDRIES
• IBM (International Business Machines)
• Infineon Technologies AG
• Samsung Electronics Co., Ltd
• STMicroelectronics
• Toshiba America Electronic Components