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Common Platform Technology Forum 2013

Venue:

Santa Clara Convention Center

Location:

Santa Clara, CA

Date:

05 February 2013

Room/Booth/Stand:

 


Advanced Physical IP Leadership

Join us at the Common Platform Technology Forum and learn more about how ARM is collaborating with GLOBALFOUNDRIES, IBM and Samsung to deliver a proven path to silicon on leading Common Platform process technologies including 90nm, 65nm, 45nm, 32nm, 28nm, 20nm and 14nm FINFET. Advanced manufacturing technology is essential to meet the requirements of the mobile and server computing markets. In collaboration with GLOBALFOUNDRIES, IBM and Samsung, ARM is delivering a full design platform of integrated process, processor and physical IP to lower the risk and reduce engineering costs associated with advanced node design.

The Common Platform Technology Forum will focus on access to industry-ready technology, proven design solutions and advanced technologies for high-growth markets such as mobile and low power. Technical details of the innovative HKMG process technology for low-power applications will be revealed, along with technology advancements in SoC enablement solutions, materials science, process technology and manufacturing.


Santa Clara Convention Center

The Santa Clara Convention Center is a complete meeting venue in the heart of Silicon Valley, CA, just south of San Francisco off Interstate I-101 at Great America Parkway.


Live Event + Online Event

The 2013 forum offers the industry a live event as well as an online event for those not able to attend in person. Visit commonplatform.com for more details and to register. Industry Keynote – Simon Segars, Executive Vice President and General Manager, Processor and Physical IP Divisions

Exhibit Hours: 11:30 am – 6:00 pm

See demos for the following products, ready for leading-edge process technology: 32nm / 28nm optimized physical IP for GLOBALFOUNDRIES, IBM and Samsung technology and find out how our collaboration with the Common Platform™ (IBM, Samsung and GLOBALFOUNDRIES) and leading EDA partners accelerates your path to silicon on leading-edge system-on-chip advanced node design.

For additional information on Common Platform Technology Forum, please visit the event page.


Dipesh Patel, ARM

Executive Vice President and General Manager, Physical IP Division    

Partnering for Innovation to Drive Diversity

It is evident that mobile computing is changing our behavior socially and in the workplace. Mobile computing is also fueling the market demand for diversity, innovation, and expansion of the semiconductor industry. The challenges faced by system and SoC designers to meet these requirements in terms of performance, power efficiency, and time-to-market continue to grow in light of advanced manufacturing technologies. In this highly competitive world, the strength of your partner ecosystem has a significant impact on your company’s ability to deliver the right product on time for commercial success. In his keynote, Dr. Patel will present his thoughts on why “Real Collaboration” on advanced process technology is a necessary and critical ingredient to address these challenges.  

About the speaker

Dipesh Patel is executive vice president and general manager of the Physical IP Division at ARM, a position he was appointed to in January 2013. He is responsible for leading the marketing, licensing, operations, design automation and engineering for the division. He is also a member of the ARM executive committee. Dipesh joined ARM in 1997 and has held senior management positions primarily in System on Chip (SoC) related activities. Previously he was vice president of technology and responsible for leading all aspects of Physical IP roadmap activities within the division. Dipesh holds a Ph.D in electronics from Loughborough University and was educated in the Executive Program at the Stanford Graduate School of Business in 2012.




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